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PIC16F57T-I/SO
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Product Detailed Parameters
- Description：IC MCU 8BIT 3KB FLASH 28SOIC
- Series：PIC® 16F
- Mfr：Microchip Technology
- Package：Tape & Reel (TR),Cut Tape (CT)
- Core Processor：PIC
- Core Size：8-Bit
- Speed：20MHz
- Connectivity：-
- Peripherals：POR, WDT
- Number of I/O：20
- Program Memory Size：3KB (2K x 12)
- Program Memory Type：FLASH
- EEPROM Size：-
- RAM Size：72 x 8
- Voltage - Supply (Vcc/Vdd)：2V ~ 5.5V
- Data Converters：-
- Oscillator Type：External
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：28-SOIC
- Package / Case：28-SOIC (0.295", 7.50mm Width)
- Grade：-
- Qualification：-
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Buying Guide
Microchip Technology PIC16F57T-I-SO is used in Microcontrollers category in embedded designs where toolchain fit and peripheral availability drive integration risk. Key specs include Description (IC MCU 8BIT 3KB FLASH 28SOIC), Core (PIC), Speed (20MHz), Flash (3KB (2K x 12)), and RAM (72 x 8).
Selection Notes
- For PIC16F57T-I-SO, verify the package/case (28-SOIC (0.295", 7.50mm Width)) fits your mechanical constraints and assembly process.
- Confirm the supply voltage requirement (2V ~ 5.5V) and any rail tolerance constraints.
- Check the I/O count (20) against your firmware pin assignment plan.
Alternates & Substitutions
- For PIC16F57T-I-SO, the closest alternates usually align on speed 20MHz and memory 3KB (2K x 12) and fit the same firmware assumptions.
- For PIC16F57T-I-SO, candidates that preserve speed 20MHz and memory 3KB (2K x 12) together are usually closer to the original part than options that match only one visible specification (key constraints: package 28-SOIC (0.295", 7.50mm Width), supply 2V ~ 5.5V).
- For Microcontrollers, the best alternate usually preserves board fit and the system-facing behavior your design already depends on.
- Compare not just the headline numbers but also the datasheet conditions behind them so paper matches do not turn into application mismatches.
FAQ
Who is the manufacturer of PIC16F57T-I-SO?
Microchip Technology
What are common selection points for a microcontroller like PIC16F57T-I-SO?
Check flash/RAM headroom, peripheral set, connectivity options, package constraints, and availability for your production horizon.
Which Supplier Device Package is specified for PIC16F57T-I-SO?
28-SOIC
Which packaging option is listed for PIC16F57T-I-SO?
Tape & Reel (TR), Cut Tape (CT)
Application Scenarios
For Microchip Technology PIC16F57T-I-SO used in Microcontrollers designs, engineers usually narrow the choice by checking the failure modes, measurement access, and constraints that still matter after layout. In real deployments, they commonly sit at the center of sensor fusion, protocol processing, or deterministic control loops where latency and reliability matter. In practice, well-matched compute devices reduce software complexity by providing the right hardware acceleration and I/O integration. In automotive gateways, compute devices survive thermal cycling and support diagnostics and safety monitoring. In building automation, they aggregate sensor data and run local logic to keep systems functional even when cloud connectivity is intermittent. In smart factories, they run real-time control and protocol stacks in cabinets with dust and vibration, where remote diagnostics and OTA updates reduce downtime.
Compatibility Advice
- In Microchip Technology PIC16F57T-I-SO integration, confirm memory interface timing and SI assumptions so firmware behavior stays stable across temperature and lot variation. Keep the same stress method and limits attached to the approval record so later reruns do not drift away from the released design.
- On the assembled PCB, check I/O voltage domains and protection so mixed-voltage interfaces do not degrade reliability over time. Keep the same stress method and limits attached to the approval record so later reruns do not drift away from the released design.
- With the final enclosure and cabling, validate power rail sequencing and decoupling close to the pins so brownouts and erratic resets are avoided. This keeps the acceptance limits tied to a test method the team can rerun later.
Project Fit
- Microchip Technology PIC16F57T-I-SO makes sense in Microcontrollers work when the team can you can validate boot/reset sequencing, power integrity, and timing margins across temperature and supply corners.
