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Product Detailed Parameters
- Description:IC EPROM 8MBIT PARALLEL 44SOIC
- Series:-
- Mfr:Microchip Technology
- Package:Tube
- Memory Type:Non-Volatile
- Memory Format:EPROM
- Technology:EPROM - OTP
- Memory Size:8Mbit
- Memory Organization:1M x 8, 512K x 16
- Memory Interface:Parallel
- Clock Frequency:-
- Write Cycle Time - Word, Page:-
- Voltage - Supply:4.5V ~ 5.5V
- Operating Temperature:0°C ~ 70°C (TC)
- Mounting Type:Surface Mount
- Package / Case:44-SOIC (0.525", 13.34mm Width)
- Supplier Device Package:44-SOIC
- Access Time:120 ns
- Grade:-
- Qualification:-
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Buying Guide
Microchip Technology AT27C800-12RC is used in Memory IC category where interface timing, endurance expectations, and power behavior affect reliability. Key specs include Description (IC EPROM 8MBIT PARALLEL 44SOIC), Temperature (0°C ~ 70°C (TC)), Package/case (44-SOIC (0.525", 13.34mm Width)), Mounting (Surface Mount), and Packaging (Tube).
- For AT27C800-12RC, confirm the operating temperature range (0°C ~ 70°C (TC)) meets your deployment conditions.
- Verify Access Time (120 ns) matches your requirements and the datasheet test conditions.
- Make sure the mounting type (Surface Mount) matches how the part will be installed and inspected.
- Verify your power rails meet the supply requirement (4.5V ~ 5.5V) under worst-case conditions.
- For AT27C800-12RC, candidates that preserve memory 8Mbit usually stay closest to the original timing and pin-use model.
- For AT27C800-12RC substitutions in Memory IC, the strongest candidates usually keep the same footprint, interface, and application role before secondary advantages matter (key constraints: package 44-SOIC (0.525", 13.34mm Width), supply 4.5V ~ 5.5V).
- When several parts look close on paper, prioritize the one that preserves the existing board fit, interface behavior, and maintenance assumptions.
- The safest second source is usually the one that leaves the board, interface, and product behavior looking familiar to the rest of the system.
What Memory Size does AT27C800-12RC have?
8Mbit
What Memory Interface is listed for AT27C800-12RC?
Parallel
What is the Supplier Device Package of AT27C800-12RC?
44-SOIC
Which supply voltage range is specified for AT27C800-12RC?
4.5V ~ 5.5V
Application Scenarios
In real deployments, microchip Technology AT27C800-12RC is usually reviewed in Memory IC designs after the team defines which released constraint would be most expensive to rediscover after build, such as contact stability, source settling, shielding, thermal rise, or service access. Engineers generally balance latency, endurance, retention, interface speed, and data integrity features such as ECC or wear management. They are typically essential for stable boot flows, logging, configuration retention, and smoothing bursty traffic in pipelines. In automotive modules, retention across temperature extremes is critical for diagnostic data and configuration consistency. In measurement systems, data buffering supports high-throughput capture sessions without dropping samples. A handful of targeted tests often shows whether the design is robust or just passes under typical conditions. This is the kind of discipline that reduces re-spin risk and keeps schedules more predictable.
Compatibility Advice
- In Microchip Technology AT27C800-12RC integration, in practice, confirm interface timing, SI margins, and power integrity on real routing so errors do not appear only at hot corners with the final enclosure and cabling.
- To avoid late rework, validate ECC and integrity strategy so intermittent errors can be detected and handled deterministically. Record the exact load, wiring, and limits so the same evidence can be regenerated during ECO or second-source review.
Project Fit
- Microchip Technology AT27C800-12RC tends to suit Memory IC builds when the team can manage lifecycle constraints like wear-out and refresh with a defined workload model.
- A practical screen is to define the acceptance checks for Microchip Technology AT27C800-12RC on the assembled design before treating it as a safe substitute in Memory IC.
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