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892-008-542-101
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Product Detailed Parameters
- Description：CONN EDGE SINGLE FML 8POS 0.100
- Series：892
- Mfr：EDAC Inc.
- Package：Bulk
- Card Type：Non Specified - Single Edge
- Gender：Female
- Number of Positions/Bay/Row：8
- Number of Positions：8
- Card Thickness：0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows：1
- Pitch：0.100" (2.54mm)
- Read Out：Single
- Features：-
- Mounting Type：Through Hole
- Termination：Wire Wrap
- Contact Material：Copper Alloy
- Contact Finish：Gold
- Contact Finish Thickness：10.0µin (0.25µm)
- Contact Type：Cantilever
- Color：Black
- Flange Feature：-
- Operating Temperature：-40°C ~ 125°C
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Buying Guide
EDAC Inc. 892-008-542-101 is evaluated in Edgeboard Connectors category when mechanical interface details determine downstream rework and reliability risk. Key specs include Description (CONN EDGE SINGLE FML 8POS 0.100), Mounting (Through Hole), Temperature (-40°C ~ 125°C), and Packaging (Bulk).
Selection Notes
- For 892-008-542-101, confirm the mounting type (Through Hole) is suitable for your production flow and reliability target.
- Validate the operating temperature range (-40°C ~ 125°C) for your environment and margin.
- Make sure Read Out (Single) aligns with your design targets and verification plan.
- Make sure Contact Finish (Gold) aligns with your design targets and verification plan.
Alternates & Substitutions
- For 892-008-542-101, the better candidates tend to keep the mating series and mechanical keying aligned along with positions 8, pitch 0.100" (2.54mm), and termination/finish Wire Wrap.
- For 892-008-542-101, when several parts look near-equivalent, the better substitute is usually the one that keeps positions 8, pitch 0.100" (2.54mm), and termination/finish Wire Wrap together in the same design context (key constraints: mounting Through Hole, packaging Bulk).
- For Edgeboard Connectors substitutions, the strongest candidates usually keep the same footprint, interface, and application role before secondary advantages matter.
- Alternates that already match mounting Through Hole, packaging Bulk are usually the easiest to adopt without mechanical surprises.
FAQ
What Contact Type is listed for 892-008-542-101?
Cantilever
Which Color is specified for 892-008-542-101?
Black
Which Contact Finish is specified for 892-008-542-101?
Gold
What Number of Positions/Bay/Row is listed for 892-008-542-101?
8
Application Scenarios
For EDAC Inc. 892-008-542-101 used in Edgeboard Connectors designs, engineers usually narrow the choice by checking the failure modes, measurement access, and constraints that still matter after layout. In real deployments, a good interconnect choice reduces intermittent resets and dropouts by keeping contact behavior repeatable over many cycles. In practice, they define how boards and cables mate, influencing reliability, manufacturability, and serviceability. In medical equipment, reliable mating reduces intermittent faults only when wipe force, retention, and cleaning exposure are validated together. In high-speed links, controlled impedance and return-path continuity matter because small discontinuities can create hard-to-debug dropouts. In battery-powered devices, connector contact resistance and mechanical stability influence voltage drop and brownout behavior under load.
Compatibility Advice
- With EDAC Inc. 892-008-542-101, during bring-up, confirm shield termination strategy and return paths so EMI behavior stays predictable in the final enclosure. Keep the same stress method and limits attached to the approval record so later reruns do not drift away from the released design.
- During bring-up, confirm mechanical stack-up and strain relief so vibration and cable pull do not degrade contact stability. This keeps the acceptance limits tied to a test method the team can rerun later.
- In production qualification, confirm mating, keying, and retention match the assembly and service workflow so intermittent faults are not introduced later before release to production.
Project Fit
- EDAC Inc. 892-008-542-101 becomes harder to justify for Edgeboard Connectors when impedance and return paths cannot be maintained through the connector system because the remaining risk is system-level and cannot be bounded by datasheet checks alone.
