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Product Detailed Parameters
- Description:CONN EDGE DUAL FMALE 40POS 0.125
- Series:846
- Mfr:EDAC Inc.
- Package:Box
- Card Type:Non Specified - Dual Edge
- Gender:Female
- Number of Positions/Bay/Row:20
- Number of Positions:40
- Card Thickness:0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows:2
- Pitch:0.125" (3.18mm)
- Read Out:Dual
- Features:-
- Mounting Type:Through Hole
- Termination:Solder
- Contact Material:Copper Alloy
- Contact Finish:Gold
- Contact Finish Thickness:10.0µin (0.25µm)
- Contact Type:Cantilever
- Color:Green
- Flange Feature:Top Mount Opening, Threaded Insert, M3
- Operating Temperature:-40°C ~ 125°C
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Buying Guide
EDAC Inc. 846-040-522-807 is evaluated in Edgeboard Connectors category when mechanical interface details determine downstream rework and reliability risk. Key specs include Description (CONN EDGE DUAL FMALE 40POS 0.125), Mounting (Through Hole), Temperature (-40°C ~ 125°C), and Packaging (Box).
- For 846-040-522-807, confirm Card Type (Non Specified - Dual Edge) and ensure it matches your integration requirements.
- Verify the mounting type (Through Hole) fits your manufacturing and inspection workflow.
- Verify the operating temperature range (-40°C ~ 125°C) and derate as needed in your application.
- Validate Flange Feature (Top Mount Opening, Threaded Insert, M3) under the expected test conditions in your application.
- For 846-040-522-807, the closest choices usually preserve mating compatibility together with positions 40, pitch 0.125" (3.18mm), and termination/finish Solder.
- For 846-040-522-807, when several parts look near-equivalent, the better substitute is usually the one that keeps positions 40, pitch 0.125" (3.18mm), and termination/finish Solder together in the same design context (key constraints: mounting Through Hole, packaging Box).
- For Edgeboard Connectors, the strongest connector alternates usually preserve the same mating family, keying, and retention style because those details decide whether a substitute is practical.
- Keeping mounting Through Hole, packaging Box consistent usually matters more than a small paper advantage elsewhere.
What details help you quote 846-040-522-807 quickly?
Send the part number (846-040-522-807), quantity, target delivery date, and any required packaging or documentation.
Can you confirm the Color for 846-040-522-807?
Green
What is the Termination of 846-040-522-807?
Solder
Which Number of Rows is specified for 846-040-522-807?
2
Application Scenarios
EDAC Inc. 846-040-522-807 is usually reviewed in Edgeboard Connectors designs after the team defines which released constraint would be most expensive to rediscover after build, such as contact stability, source settling, shielding, thermal rise, or service access. A connector that matches the real assembly, mating, and service path usually prevents more field faults than one that only looks close in the table. In practice, connector selection is as much mechanical as electrical: stack-up tolerance, strain relief, and retention decide long-term stability. In automotive harnesses, keyed connectors are judged by latch security, sealing path, and strain relief as much as by nominal pin count or pitch. In networking platforms, high-density backplane connectors enable hot-swap line cards and controlled-impedance links. In embedded devices, board-to-board connectors enable modular assemblies where stack-up tolerance and retention define reliability. In transportation electronics, keyed connectors reduce assembly errors while surviving vibration and thermal cycling.
Compatibility Advice
- With EDAC Inc. 846-040-522-807, validate mating, retention, impedance continuity, and strain relief in the final enclosure and service workflow, including the same handling steps used during service and reassembly.
Project Fit
- EDAC Inc. 846-040-522-807 makes sense in Edgeboard Connectors work when the design needs robust interconnect behavior under vibration and field handling.
- Avoid relying on EDAC Inc. 846-040-522-807 in Edgeboard Connectors designs when moisture exposure is likely but sealing is not feasible because integration risk stays high when key margins cannot be measured.
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