74LCX2244WMX

74LCX2244WMX

  • Description:IC BUF NON-INVERT 3.6V 20SOIC
  • Series:74LCX
  • Mfr:onsemi
  • Package:Tape & Reel (TR)

SKU:e81c072b1ca8 Category: Brand:

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Product Detailed Parameters

  • Description:IC BUF NON-INVERT 3.6V 20SOIC
  • Series:74LCX
  • Mfr:onsemi
  • Package:Tape & Reel (TR)
  • Logic Type:Buffer, Non-Inverting
  • Number of Elements:2
  • Number of Bits per Element:4
  • Input Type:-
  • Output Type:3-State
  • Current - Output High, Low:12mA, 12mA
  • Voltage - Supply:2V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:20-SOIC

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74LCX2244WMX

Buying Guide
Summary

onsemi 74LCX2244WMX is sourced in Buffers, Drivers, Receivers, Transceivers category when teams want clear constraints and a repeatable validation path. Key specs include Description (IC BUF NON-INVERT 3.6V 20SOIC), Series (74LCX), Packaging (Tape & Reel (TR)), Supply (2V ~ 3.6V), and Temperature (-40°C ~ 85°C (TA)).

Selection Notes
  • For 74LCX2244WMX, validate the operating temperature range (-40°C ~ 85°C (TA)) for your environment and margin.
  • Confirm Number of Elements (2) meets your design constraints and system-level expectations.
  • Ensure the package/case (20-SOIC (0.295", 7.50mm Width)) and land pattern match your PCB layout before procurement.
  • Check the supply current (12mA) in your power budget and thermal plan.
Alternates & Substitutions
  • For 74LCX2244WMX, the strongest alternates usually keep logic function Buffer, Non-Inverting aligned with the same interface role.
  • For 74LCX2244WMX in Buffers, Drivers, Receivers, Transceivers, the best alternate usually preserves board fit and the system-facing behavior your design already depends on (key constraints: package 20-SOIC (0.295", 7.50mm Width), supply 2V ~ 3.6V).
  • Keeping package/case 20-SOIC (0.295", 7.50mm Width), supplier package 20-SOIC, mounting Surface Mount consistent usually matters more than a small paper advantage elsewhere.
  • When several parts look close on paper, prioritize the one that preserves the existing board fit, interface behavior, and maintenance assumptions.
FAQ

What should I verify before using 74LCX2244WMX in production?
Confirm footprint/pinout, min/max ratings, operating temperature, and the datasheet test conditions behind key specifications.

Can you confirm the Supplier Device Package for 74LCX2244WMX?
20-SOIC

Which supply voltage range is specified for 74LCX2244WMX?
2V ~ 3.6V

Which Logic Type is specified for 74LCX2244WMX?
Buffer, Non-Inverting

Application Scenarios

onsemi 74LCX2244WMX in the Buffers, Drivers, Receivers, Transceivers category is typically shortlisted after engineers pin down the interface, margin, and field condition that will decide acceptance on assembled hardware. In many systems, careful use of interface logic reduces integration risk by making timing and signal integrity easier to validate. They are typically valuable when interface compatibility and hardware timing must be guaranteed rather than "best effort". Once the datasheet fit is clear, teams focus on the real integration work: PCB, wiring, and mechanical stack-up. In backplanes and cable links, transceivers and line drivers maintain logic thresholds and edge fidelity under impedance mismatch and EMI exposure. In mixed-voltage systems, interface devices translate levels and protect buses so contention, undershoot, and ESD do not cause intermittent failures. This approach keeps the important behaviors tied to checks that can still be measured across manufacturing variance and operating conditions.

Compatibility Advice
  • In onsemi 74LCX2244WMX integration, at the interface level, validate timing margins, skew, and edge quality on the real routing so data integrity is repeatable across temperature. Record the exact load, wiring, and limits so the same evidence can be regenerated during ECO or second-source review.
Project Fit
  • Onsemi 74LCX2244WMX makes sense in Buffers, Drivers, Receivers, Transceivers work when the team can you can validate ESD and hot-plug behavior at cable entry points so stress does not create intermittent faults.
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