71321LA35TF8

71321LA35TF8

  • Description:IC SRAM 16KBIT PARALLEL 64TQFP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)

SKU:4f004b457cb7 Category: Brand:

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Product Detailed Parameters

  • Description:IC SRAM 16KBIT PARALLEL 64TQFP
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Dual Port, Asynchronous
  • Memory Size:16Kbit
  • Memory Organization:2K x 8
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:35ns
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LQFP
  • Supplier Device Package:64-TQFP (10x10)
  • Access Time:35 ns

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71321LA35TF8

Buying Guide
Summary

Renesas Electronics Corporation 71321LA35TF8 is used in Memory IC category where interface timing, endurance expectations, and power behavior affect reliability. Key specs include Description (IC SRAM 16KBIT PARALLEL 64TQFP), Temperature (0°C ~ 70°C (TA)), Package/case (64-LQFP), Mounting (Surface Mount), and Packaging (Tape & Reel (TR)).

Selection Notes
  • For 71321LA35TF8, verify the storage capacity (16Kbit) provides enough headroom for future expansion.
  • Validate the operating temperature range (0°C ~ 70°C (TA)) for your environment and margin.
  • Confirm Write Cycle Time - Word, Page (35ns) meets your design constraints and system-level expectations.
Alternates & Substitutions
  • For 71321LA35TF8, candidates that preserve memory 16Kbit usually stay closest to the original timing and pin-use model.
  • For 71321LA35TF8 in Memory IC, use the original part as a baseline and screen alternates by what the assembly and end product cannot easily absorb (key constraints: package 64-LQFP, supply 4.5V ~ 5.5V).
  • The safest second source is usually the one that leaves the board, interface, and product behavior looking familiar to the rest of the system.
  • Candidates that remain credible across supply 4.5V ~ 5.5V, temperature 0°C ~ 70°C (TA) tend to be closer to the original production intent.
FAQ

Any tips for reliable operation with 71321LA35TF8?
Ensure robust power sequencing, adequate decoupling capacitors, and verify signal integrity on high-speed data buses.

What Memory Type is listed for 71321LA35TF8?
Volatile

Which Memory Interface is specified for 71321LA35TF8?
Parallel

What is the package/case of 71321LA35TF8?
64-LQFP

Application Scenarios

In the Memory IC category, Renesas Electronics Corporation 71321LA35TF8 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. A strong memory choice improves responsiveness and reduces the probability of data-loss edge cases in the field. They store code and data, buffer throughput, and retain critical information across resets or power events. In portable instruments, non-volatile storage preserves configuration and audit trails with controlled write policies to avoid premature wear. In industrial controllers, memory stores calibration and event logs so field issues can be diagnosed after power interruptions and network outages.

Compatibility Advice
  • In Renesas Electronics Corporation 71321LA35TF8 integration, during bring-up, verify write-protect, secure update, and rollback paths so field recovery is practical and repeatable. Record the exact load, wiring, and limits so the same evidence can be regenerated during ECO or second-source review.
  • Before release to production, validate timing margins and signal integrity on the real routing so the interface works across corners, not only at room temperature. Record the exact load, wiring, and limits so the same evidence can be regenerated during ECO or second-source review.
Project Fit
  • Renesas Electronics Corporation 71321LA35TF8 tends to suit Memory IC builds when the design needs predictable retention and brownout recovery behavior with measurable acceptance criteria.
  • Avoid relying on Renesas Electronics Corporation 71321LA35TF8 in Memory IC designs when lifetime constraints are unknown, so wear-out becomes a field issue rather than a controlled parameter because the integration depends on constraints that cannot be controlled across builds.
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