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307-042-558-158
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Product Detailed Parameters
- Description：CONN EDGE SGL FMALE 42POS 0.156
- Series：307
- Mfr：EDAC Inc.
- Package：Box
- Card Type：Non Specified - Single Edge
- Gender：Female
- Number of Positions/Bay/Row：42
- Number of Positions：42
- Card Thickness：0.054" ~ 0.070" (1.37mm ~ 1.78mm)
- Number of Rows：1
- Pitch：0.156" (3.96mm)
- Read Out：Single
- Features：Card Guides
- Mounting Type：Through Hole, Right Angle
- Termination：Solder
- Contact Material：Copper Alloy
- Contact Finish：Gold
- Contact Finish Thickness：10.0µin (0.25µm)
- Contact Type：Semi Bellows
- Color：Green
- Flange Feature：Flush Mount, Top Opening, Threaded Insert, 4-40
- Operating Temperature：-40°C ~ 105°C
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Buying Guide
EDAC Inc. 307-042-558-158 is used in Edgeboard Connectors category when mechanical fit, mating compatibility, and assembly constraints must be clear for procurement. Key specs include Description (CONN EDGE SGL FMALE 42POS 0.156), Mounting (Through Hole, Right Angle), Temperature (-40°C ~ 105°C), and Packaging (Box).
Selection Notes
- For 307-042-558-158, make sure the mounting type (Through Hole, Right Angle) matches how the part will be installed and inspected.
- Confirm the operating temperature range (-40°C ~ 105°C) meets your deployment conditions.
- Confirm Gender (Female) meets your design constraints and system-level expectations.
- Verify Card Type (Non Specified - Single Edge) matches your requirements and the datasheet test conditions.
Alternates & Substitutions
- For 307-042-558-158, the better candidates tend to keep the mating series and mechanical keying aligned along with positions 42, pitch 0.156" (3.96mm), and termination/finish Solder.
- For 307-042-558-158, when several parts look near-equivalent, the better substitute is usually the one that keeps positions 42, pitch 0.156" (3.96mm), and termination/finish Solder together in the same design context (key constraints: mounting Through Hole, Right Angle, packaging Box).
- For Edgeboard Connectors, treat near-equivalent parts as good candidates only when they preserve the same function at the product level.
- A practical substitute usually keeps mounting Through Hole, Right Angle, packaging Box stable before any secondary electrical trade-off is considered.
FAQ
Any tips for selecting alternates for 307-042-558-158?
Match mating series and footprint first, then compare rating, finish, and environmental requirements before approval.
What Card Type does 307-042-558-158 have?
Non Specified - Single Edge
What is the Contact Finish Thickness of 307-042-558-158?
10.0µin (0.25µm)
Can you confirm the Flange Feature for 307-042-558-158?
Flush Mount, Top Opening, Threaded Insert, 4-40
Application Scenarios
In the Edgeboard Connectors category, EDAC Inc. 307-042-558-158 is often evaluated by how well it fits electrical, thermal, and mechanical constraints in the target system. In serviceable products, keying and labeling reduce assembly errors and shorten repair time in the field. Long-term connector behavior is usually set by plating system, wipe geometry, latch load, and how vibration, contamination, or moisture reach the contact zone. In telecom and data center systems, controlled-impedance interconnects support hot-swap hardware where SI margin depends on the full connector and backplane path, not just the datasheet footprint. In lab equipment, repeated reconfiguration drives mating-cycle wear, so shielding and retention are validated to prevent intermittent contacts. In battery-powered devices, connector contact resistance and mechanical stability influence voltage drop and brownout behavior under load. In outdoor enclosures, sealing and corrosion resistance are essential to prevent intermittent contact faults.
Compatibility Advice
- With EDAC Inc. 307-042-558-158, validate contact resistance stability under the real environment so aging and fretting do not create sporadic failures before committing to volume builds.
Project Fit
- EDAC Inc. 307-042-558-158 makes sense in Edgeboard Connectors work when the team can you can validate mating, retention, impedance continuity, and strain relief in the final enclosure and service workflow.
